Oferta naukowo - badawcza


 about research offer of laboratories of

Centre of Microelectronics and Nanotechnology


Centre of Innovation and Transfer of Knowledge  of

University of Rzeszow

The priority of the University of Rzeszow is to create an innovative infrastructure as a scientific and educational basis for new faculties: Nanotechnology and  Materials Engineering featuring numerous domains such as: nanotechnology and  materials for aviation ( nanomaterials and nanocomposites) as well as for medical bioengineering, bioinformatics, analytical biotechnology and biomaterials.  These faculties will provide educational preparation for young people to be  concurrent on the employment market.


 The Center for Microelectronics and Nanotechnology executes research projects concerning growth,  characterization and application of nanostructures based on III-V and II-VI semiconductors materials as well as on carbon (grapheme). We also would like to introduce nanolithography and develop  MBE technology, as methods for the fabrication of nano-structures such as:  quantum wells, quantum dots or super-lattices. The Characterization of these objects will include techniques such as electron microscopy (SEM, TEM),  time-of-flight secondary ion mass spectrometry (TOF-SIMS), Raman spectroscopy  integrated  with AFM (Nano-Raman), XRD, EPR, micro-luminescence at low temperatures as well as  magneto-transport phenomena measured at super-low temperatures and high  magnetic fields.

On the other hand, the Innovation and Knowledge Transfer Centre with Laboratory of Industrial Technologies (Laboratory nr 1), is constructed to develop industry oriented technologies such as magnetotron sputtering.  The Microelectronics and Nanotechnology Center and Laboratory 1 form a complex, which enables us to implement fabrication technologies of nocel materials into industry, in particular to aviation industry. Therefore, the Microelectronics and Nanotechnology Center works in close cooperation with WSK-PZL Rzeszow, being a member of the Pratt & Whitney Group, located in the nearby Aviation Valley. 

 In the frame of The Center for Microelectronics and Nanotechnology 200 m2 of clean room surface for MBE technology,  nanopatterning and nanolithography are built. Moreover, photolithography and  electron lithography for the production of integrated circuits and element of  quantum wells will belong to the clean room equipment, as well as instruments  allowing for measurements of magneto-transport at low temperatures and optical  properties of nanostructures. In addition, students can learn how to conduct  investigations of nanodevices and quantum structures in specially organized  and equipped laboratories.


MBE Facility

MBE Compact 21 Riber two reactors for III-V and II-VI compounds linked by high-vacuum transfer, 18 effusions cells. The equipment will contain the following Ultra High Vacuum (UHV) chambers: growth chamber for III-V compound materials, growth chamber for II-VI compound materials, preparation chamber, and loading chamber with the system of substrates storage. The transfer system of substrates for epitaxy will enable moving substrates between growth chamber for III-V and II-VI materials. All the technological processes of thin films growth will be controlled by a PC computer (controlled by PC: temperatures of molecular sources, shutters of sources, temperature of main heater, main shutter). The transfer system of substrates for epitaxy will enable moving substrates between growth chamber for III-V and II-VI materials with Mercury – MCT: G. Tomaka, J. Grendysa, P. ´ Sli˙z, C. R. Becker, J. Polit, R. Wojnarowska, A. Stadler,  and E. M. Sheregii, High-temperature stability of electron transport in semiconductors with strong spin-orbital interaction, PHYSICAL REVIEW B 93, 205419 (2016).


Nanolithography Facility

 The Helios 650 dual beam SEM/FIB microscope is the first of the NanoLab  instruments line installed in Poland by FEI Company (Eindhoven, The Netherland). Due to its particular column design, it  delivers a sub-nanometer SEM resolution (up to 30 kV acceleration voltage) and  provides a high thermal stability, good deflection linearity and fast  electrostatic scanning. Such parameters, combined with a precision piezo-stage  and accurate ion-milling, will enable a high through-output, multi-level  lithography and will have an immediate impact on microscope based quantum  device research, conducted in the Center.  The multi-technique patterning and nano-fabrication based on electrons and  galium atoms, which is enabled through the MultiBeam attachment, is able to  handle rather complex patterns and overlay lithography jobs. For example, the  so-called "patterning on SEM image", important for prototype devices usually  patterned on untypical substrates, is provided by the GDSII editor.  Furthermore, flexible directional exposure modes, essential for precise  ion-milling, are also supported. Finally, the application of nanoPECS system,  which calculates the proximity corrections and simulates developed re Facility for Electron Microscopy & Sample Preparation deep-  profiles, will shorten considerably the development time needed for new device  fabrication. It allows for the  TEM  sample preparation and extends the applications range for 3D characterization  and nano-analysis or structural modification of sample surfaces at the  nanometer scale: E.M. Sheregii, D. Płoch, T. Płociński, W. Gębicki, Interface Quality and Interface Modes in the Double Quantum Wells structure, Surface and Interface Analysis, 48, 498 (2016) DOI: 10.1002/sia.6027.

            Two Laboratories, MBE and Nanolithography, have manufacturing technologies of the Focal Plane Arrays  for Infrared Radiation used in aviation for Earth observation and security.

Laboratory for low-temperature luminescence and micro-Raman researches. Micro-luminescence in the spectrum region 200 – 2000 nm  is investigated on nanostructures including bio-nano-objects. Micro-Raman facility consists from the Raman Renishow spectrometer (spectrum region 200 – 2000 nm)  integrated with the Bruker AFM Innova with lasers for 732 nm: the facility is using to research the nanostructures including the bio-nano-objects as complexes Au-nanoparticles+enzymes: R. Wojnarowska, J. Polit, D. Broda, M. Gonchar, E. M. Sheregii, “Surface enhanced Raman scattering as a probe of the cholesterol oxidase enzyme”, Applied Physics Letters, 106, 103701 (2015)

 Facility for Magnetron Sputtering

Magnetron sputtering is widely used for coating cutting and punching tools, that requires using of wear and corrosion resistant materials with high working temperature (700 C) and sufficient thermal conduction for heat removal from the treatment zone. The modular Platform for growth of the Protection Coatings is installed  the Innovation and Knowledge Transfer Centre with Laboratory of Industrial Technologies (Laboratory nr 1). That include the chambers for

-magnetron sputtering;

-thermal sputtering

-laser ablation.

There are possibilities to inject the gases – nitrogen and oxygen in the chambers at the growth

process: N. Berchenko, R. Vitchev, W. Bochnowski, M. Trzyna, S. Adamiak, A. Dziedzic, An out-

of-specification element oxide found in the subsurface layer of Ni superalloys after annealing in air.

Corr. Sci.108 205–208 (2016).


Facility for Electron Microscopy & Sample Preparation.

 Tecnai Osiris™ installed at the Facility for Electron Microscopy & Sample  Preparation in the Center for Microelectronics & Nanotechnology.  The Tecnai Osiris™, installed in October 2012 at the Facility for Electron Microscopy & Sample Preparation, is a remote controlled, high performance  200kV S/TEM  system, offering outstanding performance in all imaging and  analytical modes. The combination of a high brightness field emitter and a  windowless EDX detection system using Silicon Drift Detector (SDD) technology,  lead to extremely high count rates for a given beam current and significantly  improved sensitivity for light elements. Fast mapping reduces the acquisition  time for elemental mappings down to the one for a high quality Scanning TEM image, turning the grey-scale image contrast into color-coded elemental information.

 The Quanta 3D SEM/FIB dual beam with a tungsten cathode is an excellent  alternative for the classic mechanical polishing and ion milling technique for  the TEM sample preparation. It brings new capabilities and flexibility to  engineers and researchers needing to characterize materials and conduct  failure analysis in an industrial or academic environment. It allows for the  TEM  sample preparation and extends the applications range for 3D characterization  and nano-analysis or structural modification of sample surfaces at the  nanometer scale. In particular the Omniprobe micromanipulator system for  lifting out the lamellas allows to re-thin samples, which were found to be too  thick for the TEM observations.   

Facility for Electron Paramagnetic Resonance Spectroscopy.  Modern EPR-spectrometer enable us to measure the magnetic centers in solid states with accuracy of 1018 cm-1. It is important for controlling the quality of materials for metallurgy forms: NUKLEONIKA, 60, 399-403 (2015)

Facility for Non-destructive control of materials for aerospace industry. Thermography (camera FLIR SC7000) offers noncontact, wide area detection of material defects, and can be used as an alternative of or a complement to the conventional inspection technologies. The essence of these researches is the thermal response analysis of a material stimulated by an external heat impulse: Infrared Physics & Technology, 76 574–579 (2016).



 The Center for Microelectronics & Nanotechnology acknowledges the support of the  Ministry of Regional Development and to the Ministry of Science and Higher  Education of Poland, project nr UDA-POIS.13.01-018/08-00, in the frame of the Operating Program  Infrastructure and Environment 2008-2014.